Annealing & Etching

• Compact Rapid Thermal Annealing System AO500 
• AsBr₃ In-Situ Etching System ISES 

Effusion Cells / Other Sources

• Large Capacity Ga/In Production Effusion Cell 
• Compact Effusion Cells for thin film deposition or MBE in research UHV systems 
• Organic Material Effusion Cell OME 
• Oxygen Resistant Effusion Cells 
• GaP Compound Source DECO 
• Silicon Sublimation Source SUSI 
• Carbon Sublimation Source SUKO 

Valved Sources

• Valved GaP Compound Source VGCS 
• Valved Arsenic Cracker Source VACS 
• Valved Corrosive Material Cracker Source VCCS 
• Valved Alkali Metal Source AKS 
• Valved Mercury Evaporation Source HGS 

E-beam Evaporators

• Standard Electron Beam Evaporators EBV 
• UHV Linear Multi-pocket Evaporators EBVM 
• Vertical Electron Beam Evaporators EBVV 

Dopant Cells

• Dual Dopant Sources DCS 
• P-Doping Source for Si/SiGe MBE DECO-D 
• Boron Doping Source EBVV-B 63-5 

Gas Sources

• Hydrogen Atom Beam Source HABS 
• Oxygen Atom Beam Source OBS 

 LAST UPDATE: SEPTEMBER, 2010

© 2003 Dr. Eberl MBE-Komponenten GmbH